- M.2
- Gen Z
- MCIO
- DDR5
- Dongle
- Automotive
- Board to Board Connector
- Wire to Board Connector
- USB Type C Connector
- USB 3.0 Connector
- USB 2.0
- SATA Connector
- SAS Connector
- Mini & Micro Lock Connector
- Power Connector
- FFC/FPC Connector
- DC JACK Connector
- Battery Connector
- HDMI Connector
- Card Connector
- Pin Header Connector
- RJ Connector
- Mini Circular Connector
- RF Connector
- High Speed Cable Assembly
- High Speed Connector
- Industrial
- New Energy Storage Cabinet Cable
- DC Power Cable
- Type C cable
- HDMI cable
- Wire Harness
- Socket
- Pet angel
- Respiratory nebulizer
- Automotive digital multimedia integration
- Metal stamping parts
-
Bracket
CPU Expansion Card Bracket
-
CPU fan bracket
Processes: Electroplating, soldering, screw insertion, thin film bonding.
-
EMI Shielding
Material: SPTE, SGCC
Thickness: 0.15~0.3mm Bonding
material: Insulating PET film -
I/O SHIELDING
Used for the Input & Output positions on the motherboard.
Processes: Insertion, printing, thin film bonding. -
Medium to large-sized chassis assembly components
-
Medium-sized structural components
Processes: Electroplating, soldering, baking paint, insertion, printing, thin film bonding
-
Mid-size computer case
Processes: Electroplating, baking paint, printing, insertion, assembly
-
Thin stainless steel structural parts
-
Types and sizes of aluminum structural exterior parts
-
Types of medium-sized sturdy framework brackets
Material: SPCC, SGCC
Bonding material: Thermal conductive adhesive
Processes: Electroplating, baking paint, insertion, printing, thin film bonding
